Product Development

Lectures and Presentations

Lectures and presentations about Tri Chemical Laboratories’ R&D are introduced below.

Title SiO2 deposition by low-temperature ALD using SiBr4
Presented The 79th JSAP Autumn Meeting
September 21, 2018 at Nagoya
Title Realization of High Stable Porous SiOCH Films (k=2.3-2.4, Er=8.0 GPa) using DcPDMOS by O2 Addition and UV Cure
Presented Advanced Metallization Conference 2008: 18th Asian Session
October 8, 2008 at The University of Tokyo
Title Realization of High Stable Porous SiOCH Films (k=2.3-2.4, Er=8.0 GPa) using DcPDMOS by O2 Addition and UV Cure
Presented Advanced Metallization Conference 2008: 18th Asian Session
October 8, 2008 at The University of Tokyo
Title Realization of High Stable Porous SiOCH Films (k=2.3-2.4, Er=8.0 GPa) using DcPDMOS by O2 Addition and UV Cure
Presented Advanced Metallization Conference 2008 (AMC) 2008
September 23, 2008 at San Diego, U.S.A
Title Chemical Vapor Deposition of Ni-Pt thin film using Pt(PF3)4 and Ni(PF3)4
Presented ADMETA 2007 17th Asian Session
October 23, 2007 at The University of Tokyo
Title Deposition of a Ni-Pt thin film by CVD using Pt(PF3)4/Ni(PF3)4
Presented Workshop at the Institute of Cutting-edge Semiconductor Research
October 6, 2007 at Meiji University
Title W-CVD using biscyclopentadienyltungsten system
Presented Advanced Metallization Conference 2006 (AMC) 2006
October 18, 2006 at San Diego, U.S.A
Title Properties of chemical reaction during Ni and Ni-silicide deposition using Ni(PF3)4 and Si3H8
Presented Advanced Metallization Conference 2006 (ADMETA2006)
September 26, 2006 at Tokyo, Japan
TitleProperties of Ni and Ni-silicide deposition using Ni(PF3)4 and Si3H8
Presented International Workshop on Sustainable Energy and Materials (IWSEM2006)
September 5, 2006 at Tokyo, Japan
TitleW-CVD using (i-PrCp)2WH2
PresentedInternational Workshop on Sustainable Energy and Materials (IWSEM2006)
September 5, 2006 at Tokyo, Japan
Title Formation of a Ni-silicide by CVD (II)
Presented The 67th JSAP Meeting
August 31, 2006 at Ritsumeikan University
TitleChemical Vapor Deposition of NiSi using Ni(PF3)4 and Si3H8
PresentedAsia-Pacific Conference on Semiconducting Silicide 2006 (APAC-silicide 2006)
July 30, 2006 at kyoto, Japan
Title Ultra Low-k Film Deposition By PECVD Using a Novel Organosilane as a Precursor
Presented2006 MRS Spring Meeting
April 18, 2006 at San Francisco, CA
TitleFormation of a Ni-silicide by CVD
PresentedThe 53rd JSAP Associate Meeting
March 24, 2006 at Musashi Institute of Technology
Title Ni-silicide precursor for gate electrodes
Presented27th International Symposium of Dry Process (DPS2006)
November 29, 2005 at Cheju, Korea
Title Chemical Vapor Deposition of Ni-silicide for gate electrodes
PresentedAdvanced Metallization Conference 2005 (ADMETA2005)
October 13, 2005 at Tokyo, Japan
TitleComposition control of Ni-silicide by CVD using Ni(PF3)4 and Si3H8
PresentedThe 2005 International Conference on Solid State Devices and Materials (SSDM 2005)
September 14, 2005 at Kobe, Japan
TitleDeposition of Ni-silicide gate electrodes by CVD
PresentedThe 66th JSAP Meeting
September 10, 2005 at Tokushima University
TitleLiquid CVD material (i-PrCp) 2WH2 for W deposition
PresentedThe 67th JSAP Meeting
September 10, 2005 at Tokushima University
TitleDeposition of a Low-k thin film by PECVD using a new Si compound
PresentedThe 66th JSAP Meeting
September 7, 2005 at Tokushima University
TitleNickel thin film deposition using Ni(PF3)4 for LSI electrode
Presented207th meeting of Electrochemical society (ECS)
May 17, 2005 at Quebec, Canada
TitleDeposition of a Ni thin film using Ni(PF3)4 (II)
PresentedThe 52nd JSAP Associate Meeting
April 1, 2005 at Saitama University
TitleNi Thin Film Deposition using tetrakistrifluorophosphinenickel (0), Ni(PF3)4
PresentedAdvanced Metallization Conference 2004 (ADMETA2004)
September 29, 2004 at Tokyo, Japan
TitleDeposition of a Ni thin film using Ni(PF3)4
PresentedThe 65th JSAP Meeting
September 2, 2004 at Tohoku Gakuin University
TitleSurface reactions in Ni MOCVD using cyclopentadienylallylnickel as a precursor
Presented14th International Conference on Crystal Growth (ICCG-14)
August 9, 2004 at Grenoble, France
TitleNi deposition by MOCVD
PresentedThe 51st JSAP Associate Meeting
March 28, 2004 at Tokyo University of Technology
TitleNi precursor for chemical vapor deposition of NiSi
PresentedThe 2003 International Conference on Solid State Devices and Materials (SSDM 2003)
September 17, 2003 at Tokyo, Japan
TitleNiSi(II) deposition by MOCVD
PresentedThe 64th JSAP Meeting
August 31, 2003 at Fukuoka University
TitleOrganometallic Hf and Si precursors for Hf1-XSi XO2 thin film formation
PresentedAdvanced Metallization Conference 2002 (ADMETA2002)
October 30, 2002 at Tokyo, Japan
TitleOrganometallic Hf and Si precursors for HfSiO2-CVD and ALD process
PresentedAtomic Layer Deposition Conference (ALD2002)
August 20, 2002 at Seoul, Korea
TitleHfO2 and Hf1-xSixO2 deposition by MOCVD using TDEAH
PresentedAdvanced Metallization Conference 2001 (ADMETA2001)
October 30, 2001 at Tokyo, Japan
TitleDeposition of a HfO2 film by MOCVD (III)
PresentedThe 62nd JSAP Meeting
September 2, 2001 at Aichi Institute of Technology

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